Charlie Jun Zhai

Publications

Citations

H-Index

2005

Active since

Affiliations

Advanced Micro Devices (United States)(Current)

Charlie Jun Zhai is an author at Advanced Micro Devices (United States) specializing in electronic packaging, mechanics of materials, and microelectronics.

Top concepts

EngineeringMaterial ScienceMicroelectronicsElectronic PackagingMechanics Of MaterialsSolid MechanicsElectrical EngineeringMechanical EngineeringMechanics3D Printing

Publications per year

2005–2008

Publications

Investigation of Cu/Low-K Film Delamination in Flip-Chip Packages

Charlie Jun Zhai, U. Ozkan, A. DubeySidharth et al. · 2006 · 45 citations

Energy Release Rate, Engineering, Mechanical Engineering +18

A physically based lifetime model for stress-induced voiding in interconnects

Charlie Jun Zhai, Richard C. Blish · Journal of Applied Physics · 2005 · 25 citations

Engineering, Line Width, Defect Tolerance +22

3D fracture mechanics analysis of underfill delamination for flip chip packages

Zhen Zhang, Charlie Jun Zhai, R.N. Master · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 2008 · 13 citations

Engineering, Underfill Delamination, Flip Chip Package +20

Reliability Modeling of Lidded Flip Chip Packages

Charlie Jun Zhai, Seah S. Too, R.N. Master · 2007 · 11 citations

Engineering, Mechanical Engineering, Computer Architecture +21

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