Charlie Jun Zhai - Concepedia

Author

Charlie Jun Zhai

Advanced Micro Devices (United States)

Also Known As

Charlie J Zhai, Charlie J. Zhai, Charlie Jun Zhai, Charlie Zhai

Publications

104

Citations

H-Index

Concepts

All Affiliations

Advanced Micro Devices (United States)Advanced Micro Devices (Canada)

About

Charlie Jun Zhai is an author at Advanced Micro Devices (United States) specializing in electronic packaging, mechanics of materials, and microelectronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	4	4	94
2	Electrical Engineering	3	3	83
3	Applied Physics	2	2	70
4	Materials Engineering	2	2	70
5	Computer Engineering	1	1	11

Charlie Jun Zhai

Publications

Citations

H-Index

Page 1

	Year	Citations
Investigation of Cu/Low-K Film Delamination in Flip-Chip Packages Charlie Jun Zhai, U. Ozkan, A. DubeySidharth, Energy Release RateEngineeringMechanical EngineeringCpi ReliabilityFlip-chip Packages	2006	45
A physically based lifetime model for stress-induced voiding in interconnects Charlie Jun Zhai, Richard C. Blish Journal of Applied Physics EngineeringLine WidthDefect ToleranceInterconnect (Integrated Circuits)Reliability Engineering	2005	25
3D fracture mechanics analysis of underfill delamination for flip chip packages Zhen Zhang, Charlie Jun Zhai, R.N. Master I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems EngineeringUnderfill DelaminationFlip Chip PackageMechanical EngineeringFlip Chip Packages	2008	13
Reliability Modeling of Lidded Flip Chip Packages Charlie Jun Zhai, Seah S. Too, R.N. Master EngineeringMechanical EngineeringComputer ArchitectureFlip Chip PackagesHardware Security	2007	11

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