Sarah H. Knickerbocker

Author

Also Known As

S. H. KNICKERBOCKER, S. H. Knickerbocker, S. KNICKERBOCKER, S. Knickerbocker, Sarah H. Knickerbocker, Sarah Knickerbocker

Publications

509

Citations

H-Index

Concepts

All Affiliations

IBM (United States)American Ceramic Society GlobalFoundries (United States)IBM Research - Thomas J. Watson Research Center University of Illinois Urbana-Champaign

About

Sarah H. Knickerbocker is an author at IBM (United States) specializing in engineering, materials science, and mechanical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	8	8	394
2	Applied Physics	3	3	111
3	Electrical Engineering	2	2	52
4	Materials Engineering	2	2	57
5	Computer Engineering	1	1	14

Sarah H. Knickerbocker

Publications

486

Citations

H-Index

Page 1

	Year	Citations
Cordierite glass-ceramics for multilayer ceramic packaging Sarah H. Knickerbocker, Alip Kumar, L. W. Herron American Ceramic Society bulletin Materials ScienceGlass-ceramicSilicate CeramicsMultilayer Ceramic PackagingEngineering	1993	192
Sinterable β‐Spodumene Glass‐Ceramics Sarah H. Knickerbocker, Michelle R. Tuzzolo, Samuel Lawhorne Journal of the American Ceramic Society	1989	81
High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution Rao Tummala, John Knickerbocker, Sarah H. Knickerbocker, IBM Journal of Research and Development Materials ScienceGlass-ceramicMolybdenum PasteEngineeringMaterials Fabrication	1992	41
High‐Temperature Mechanical Properties and Microstructures for Hot‐Pressed Silicon Nitrides with Amorphous and Crystalline Intergranular Phases Sarah H. Knickerbocker, Avigdor Zangvil, Sherman D. Brown Journal of the American Ceramic Society EngineeringMechanical EngineeringGrain‐boundary PhaseStructural MaterialsFracture Stress	1985	40
Face to Face Hybrid Wafer Bonding for Fine Pitch Applications Daniel Fisher, Sarah H. Knickerbocker, Daniel M. Smith, Materials EngineeringMaterials ScienceElectrical EngineeringWafer Scale ProcessingEngineering	2020	38
Displacement Rate and Temperature Effects in Fracture of a Hot‐Pressed Silicon Nitride at 1100° to 1325°C Sarah H. Knickerbocker, Avigdor Zangvil, S. D. Brown Journal of the American Ceramic Society EngineeringHot‐pressed Silicon NitrideSevere Plastic DeformationMechanical EngineeringTemperature Vs	1984	30
50&#x03BC;m pitch Pb-free micro-bumps by C4NP technology Bing Dang, Da‐Yuan Shih, Stephen L. Buchwalter, EngineeringMechanical EngineeringIbm ManufacturingFlip Chip PackagesMicro-electromechanical System	2008	20
Viscosity of MgO-Al2O3-SiO2-B2O3-P2O5 cordierite-type glasses Edward A. Geiss, Sarah H. Knickerbocker Journal of Materials Science Letters Materials ScienceMaterials EngineeringGlass-ceramicMgo-al2o3-sio2-b2o3-p2o5 Cordierite-type GlassesEngineering	1985	19
A high-density logic-on-logic 3DIC design using face-to-face hybrid wafer-bonding on 12nm FinFET process Siddhartha Sinha, S. C. H. Hung, Daniel Fisher, EngineeringVlsi DesignFinfet ProcessComputer ArchitectureComputer-aided Design	2020	14
End-to-End Integration of a Multi-die Glass Interposer for System Scaling Applications Brittany Hedrick, Vijay Sukumaran, Benjamin Fasano,	2016	11

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