Concepedia

Roy Knechtel

RK

5

Publications

300

Citations

5

H-Index

2005

Active since

Affiliations

X-Fab (Germany)(Current)

Roy Knechtel is an author at X-Fab (Germany) specializing in electronic packaging, engineering, and materials science.

Top concepts

EngineeringMaterial ScienceElectronic PackagingApplied PhysicsMicrofabricationSurface ScienceMicroelectronicsMaterials Engineering

Publications per year

2005–2021

5

Publications

5

Glass frit bonding: an universal technology for wafer level encapsulation and packaging

Roy Knechtel · Microsystem Technologies · 2005 · 185 citations

Materials Science, Materials Engineering, Chip-scale Package +11

Wafer level encapsulation of microsystems using glass frit bonding

Roy Knechtel, Maik Wiemer, Jörg Frömel · Microsystem Technologies · 2005 · 84 citations

Materials Science, Wafer Scale Processing, Engineering +5

Glass Frit Wafer Bonding for Encapsulating Monolithic Integrated CMOS-MEMS Devices

Roy Knechtel, Matthias Zellmer, Marc Schikowski et al. · ECS Transactions · 2018 · 11 citations

A test structure for characterization of the interface energy of anodically bonded silicon-glass wafers

Roy Knechtel, M. Knaup, J. Bagdahn · Microsystem Technologies · 2005 · 10 citations

Materials Science, Glass-ceramic, Wafer Scale Processing +11

The Importance of Wafer Edge in Wafer Bonding Technologies and Related Wafer Edge Engineering Methods

Roy Knechtel, Uwe Schwarz, Sophia Dempwolf et al. · ECS Journal of Solid State Science and Technology · 2021 · 10 citations · Full text

Rows per page

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