Journal of Physics D Applied Physics · 2013 · 66 citations · 28 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsInterface ScienceSemiconductor MaterialsMetal OxidesMos CapacitorsOxide SemiconductorsSemiconductor Device MaterialsSemiconductor InterfacesSemiconductor SurfacesAnnealingAnnealing EffectsAnnealing Temperature EffectsGallium NitrideGallium OxideOxide ChargeOxygen-bearing SpeciesPost-deposition Annealing
The electrical characteristics of the Al2O3/GaN metal–insulator–semiconductor capacitors are investigated focusing on the effect of post-deposition annealing (PDA) in O2 ambient. X-ray photoelectron spectroscopy analyses reveal that gallium oxynitride (GaOx Ny) interfacial layer is formed at Al2O3/GaN interface even in non-annealed sample due to incorporation of the released oxygen from Al2O3. After PDA in O2 ambient, the GaOx Ny interfacial layer becomes oxygen-rich which plays a role in increasing negative effective oxide charge at the Al2O3/GaN interface and hence positively shifting the flat band voltage (VFB) for the capacitors.
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