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Effect of oxygen species on the positive flat-band voltage shift in Al<sub>2</sub>O<sub>3</sub>/GaN metal–insulator–semiconductor capacitors with post-deposition annealing
63
Citations
28
References
2013
Year
SemiconductorsOxide HeterostructuresElectrical EngineeringMaterials SciencePost-deposition AnnealingEngineeringAluminium NitrideWide-bandgap SemiconductorOxide ElectronicsSurface ScienceApplied PhysicsAluminum Gallium NitrideGan Power DeviceGallium OxideGallium OxynitrideOxygen SpeciesGaox Ny
The electrical characteristics of the Al2O3/GaN metal–insulator–semiconductor capacitors are investigated focusing on the effect of post-deposition annealing (PDA) in O2 ambient. X-ray photoelectron spectroscopy analyses reveal that gallium oxynitride (GaOx Ny) interfacial layer is formed at Al2O3/GaN interface even in non-annealed sample due to incorporation of the released oxygen from Al2O3. After PDA in O2 ambient, the GaOx Ny interfacial layer becomes oxygen-rich which plays a role in increasing negative effective oxide charge at the Al2O3/GaN interface and hence positively shifting the flat band voltage (VFB) for the capacitors.
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