Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact

Impact life prediction modeling of TFBGA packages under board level drop test

Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim et al. · Microelectronics Reliability · 2004 · 192 citations

Reliability Engineering, Engineering, Life Prediction +8

Predicting plated-through-hole reliability in high temperature manufacturing processes

R. Iannuzzelli · 2002 · 97 citations

Engineering, Industrial Engineering, Mechanical Engineering +16

Support excitation scheme for transient analysis of JEDEC board-level drop test

Chang-Lin Yeh, Yi‐Shao Lai · Microelectronics Reliability · 2005 · 88 citations

Electrical Engineering, Reliability Engineering, Engineering +4

Advanced Numerical and Experimental Techniques for Analysis of Dynamic Responses and Solder Joint Reliability During Drop Impact

Jing En Luan, Tong Yan Tee, E. Pek et al. · IEEE Transactions on Components and Packaging Technologies · 2006 · 79 citations

Engineering, Impact (Mechanics), Structural Crashworthiness +20

Characterization of lead-free solders and under bump metallurgies for flip-chip package

Jong‐Kai Lin, A. De Silva, D. R. Frear et al. · 2002 · 55 citations

Engineering, Pb-free Solders, Mechanical Engineering +17