Chan-Yen Chou

Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact

Chan-Yen Chou, Tuan-Yu Hung, Shin-Yueh Yang et al. · Microelectronics Reliability · 2008 · 28 citations

Electrical Engineering, Chip-scale Package, Engineering +8

Design, analysis, and development of novel three-dimensional stacking WLCSP

C. YUAN, C. N. Han, Ming‐Chih Yew et al. · IEEE Transactions on Advanced Packaging · 2005 · 27 citations

Engineering, Mechanical Engineering, Computer-aided Design +16

Reliability assessment for solders with a stress buffer layer using ball shear strength test and board-level finite element analysis

Ming‐Chih Yew, Chan-Yen Chou, Kuo‐Ning Chiang · Microelectronics Reliability · 2007 · 18 citations

Reliability, Electrical Engineering, Reliability Engineering +12

Prediction of the bulk elastic constant of metals using atomic-level single-lattice analytical method

Kuo‐Ning Chiang, Chan-Yen Chou, Chung-Jung Wu et al. · Applied Physics Letters · 2006 · 15 citations

Materials Science, Engineering, Single Bcc +14

Development of Empirical Equations for Metal Trace Failure Prediction of Wafer Level Package Under Board Level Drop Test

Chan-Yen Chou, Tuan-Yu Hung, Chao-Jen Huang et al. · IEEE Transactions on Advanced Packaging · 2010 · 11 citations

Engineering, Mechanical Engineering, Cumulative Damage +21