Ming‐Chih Yew

Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact

Chan-Yen Chou, Tuan-Yu Hung, Shin-Yueh Yang et al. · Microelectronics Reliability · 2008 · 28 citations

Engineering, Materials Engineering, Computer-integrated Manufacturing +16

Design, analysis, and development of novel three-dimensional stacking WLCSP

C. YUAN, C. N. Han, Ming‐Chih Yew et al. · IEEE Transactions on Advanced Packaging · 2005 · 27 citations

Engineering, Design, Manufacturing Engineering +15

Warpage Modeling and Characterization of the Viscoelastic Relaxation for Cured Molding Process in Fan-Out Packages

Shu‐Shen Yeh, Po-Yao Lin, Kuang-Chun Lee et al. · 2017 · 19 citations

Engineering, Materials Engineering, Materials Science +15

Reliability assessment for solders with a stress buffer layer using ball shear strength test and board-level finite element analysis

Ming‐Chih Yew, Chan-Yen Chou, Kuo‐Ning Chiang · Microelectronics Reliability · 2007 · 18 citations

Engineering, Materials Engineering, Materials Science +17

Reliability analysis of a novel fan‐out type WLP

Ming‐Chih Yew, Mars Tsai, Dyi‐Chung Hu et al. · Soldering and Surface Mount Technology · 2009 · 14 citations

Engineering, Electrical Engineering, Materials Engineering +17