Shin-Yueh Yang

Overview and applicability of residual stress estimation of film–substrate structure

Tsung-Lin Chou, Shin-Yueh Yang, Kuo‐Ning Chiang · Thin Solid Films · 2011 · 53 citations

Materials Science, Engineering, Strain Localization +7

Light degradation test and design of thermal performance for high-power light-emitting diodes

Yen-Fu Su, Shin-Yueh Yang, Tuan-Yu Hung et al. · Microelectronics Reliability · 2011 · 42 citations

White Oled, Electrical Engineering, High-power Light-emitting Diodes +10

Analysis of Thermal and Luminous Performance of MR-16 LED Lighting Module

Wei-Hao Chi, Tsung-Lin Chou, Cheng-Nan Han et al. · IEEE Transactions on Components and Packaging Technologies · 2010 · 42 citations

White Oled, Electrical Engineering, Solid-state Lighting +8

Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact

Chan-Yen Chou, Tuan-Yu Hung, Shin-Yueh Yang et al. · Microelectronics Reliability · 2008 · 28 citations

Electrical Engineering, Chip-scale Package, Engineering +8

Bi-dimensional finite element analysis for modal separation of a circular cylindrical WW-USM

Tai-Ho Yu, Shin-Yueh Yang, Chen-Liang Lee et al. · Finite Elements in Analysis and Design · 2011 · 18 citations

Modal Analysis, Finite Element Method, Numerical Analysis +9