Statistics
Publications
4
Citations
45
H-Index
4
Active since
2007
Affiliations
National Tsing Hua University(Current)
Dyi‐Chung Hu is an author at National Tsing Hua University specializing in packaging engineering, chip packaging, and engineering.
Publications per year
2007–2009
4
4
Reliability analysis of a novel fan‐out type WLP
Ming‐Chih Yew, Mars Tsai, Dyi‐Chung Hu et al. · Soldering and Surface Mount Technology · 2009 · 14 citations
Engineering, Electrical Engineering, Materials Engineering +17
1–4 of 4