2008 · 10 citations · 8 references
EngineeringComputer EngineeringPackaging DesignImpact BehaviorImpact MechanicsPackaging EngineeringStress AnalysisStress TestingStress-strain BehaviorDrop Impact AnalysisDrop TestingImpact Resistance TestingImpact Stress AnalysisImpact TestingMaterial Failure Under ImpactStress Management In Packaging
In this research, the objective is to develop a stress-buffer-enhanced package subjected to board level drop test under a high-G impact drop; both drop test experiments and ANSYS/LS-DYNA simulations are executed.
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Board level drop test reliability of IC packages
T.C. Chai, Ser Tong Quek, Wai Yin Hnin et al. · 2005 · 41 citations