Po-Yao Lin

Multilayer RDL Interposer for Heterogeneous Device and Module Integration

Yi-Hang Lin, M.C. Yew, S.M. Chen et al. · 2019 · 72 citations

3D Ic Architecture, Electrical Engineering, Chip-scale Package +14

Reliability Performance of Advanced Organic Interposer (CoWoS®-R) Packages

Po-Yao Lin, M.C. Yew, Shu‐Shen Yeh et al. · 2021 · 40 citations

Engineering, Mechanical Engineering, Computer Architecture +20

3D Heterogeneous Integration with Multiple Stacking Fan-Out Package

Feng-Cheng Hsu, Jackson Ching-Tzer Lin, Shuo-Mao Chen et al. · 2018 · 32 citations

Engineering, Computer Architecture, 3D Modeling +22

Warpage Modeling of Ultra-Thin Packages Based on Chemical Shrinkage and Cure-Dependent Viscoelasticity of Molded Underfill

Po-Yao Lin, Sanboh Lee · IEEE Transactions on Device and Materials Reliability · 2019 · 20 citations

Engineering, Mechanical Engineering, Muf Physical Behavior +21

Thermal Challenges for HPC 3DFabric^TM Packages and Systems

Kathy Wei Yan, Po-Yao Lin, Sheng-Liang Kuo · 2022 IEEE International Reliability Physics Symposium (IRPS) · 2022 · 19 citations