M.C. Yew

Multilayer RDL Interposer for Heterogeneous Device and Module Integration

Yi-Hang Lin, M.C. Yew, S.M. Chen et al. · 2019 · 72 citations

3D Ic Architecture, Electrical Engineering, Chip-scale Package +14

Reliability Performance of Advanced Organic Interposer (CoWoS®-R) Packages

Po-Yao Lin, M.C. Yew, Shu‐Shen Yeh et al. · 2021 · 40 citations

Engineering, Mechanical Engineering, Computer Architecture +20

Organic Interposer CoWoS-R⁺ (plus) Technology

Mu-Shan Lin, M.S. Liu, Hsien‐Wei Chen et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 35 citations

Engineering, Vlsi Design, Computer Architecture +18

Next Generation Large Size High Interconnect Density CoWoS-R Package

Chien-Hsun Lee, YH Hu, SM Chen et al. · 2024 · 20 citations

High Performance Heterogeneous Integration on Fan-out RDL Interposer

Shuo-Mao Chen, M.C. Yew, Feng-Cheng Hsu et al. · 2019 · 15 citations