Multilayer RDL Interposer for Heterogeneous Device and Module Integration

Abstract

in this paper, we demonstrate a high density heterogeneous large package using a RDL interposer with six interconnection layers. Four Si chiplets and two HBM modules are connected with fine pitch copper lines to deliver a complete system-in-package solution for high performance computation. The multilayer interconnections provide excellent design flexibility to optimize signal, power, and ground planes. The RDL interposer has generic structural advantages in interconnection integrity and bump joint reliability, which allows further scaling up of The package size for more complicated functional integration.