Heterogeneous Integration

Heterogeneous Integration is a fabrication and design methodology in which dissimilar semiconductor devices or functional components—such as electronic and photonic circuits, fabricated in different material systems or process technologies—are combined within a single chip package or interposer platform to achieve enhanced performance, functionality, or form factor, while maintaining electrical and thermal compatibility across integrated domains.

839

Publications

41.6K

Citations

4.4K

Authors

790

Institutions

Publications per year

2017–2026

451

Parents

Chip PackagingIntegrated PhotonicsNetwork-on-chip DesignPhotonic Integrated CircuitsSilicon Photonics

Publications

839

3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration

Kaustav Banerjee, S.J. Souri, Pawan Kapur et al. · Proceedings of the IEEE · 2001 · 1K citations

Engineering, Computer Engineering, Electrical Engineering +17

Status and Potential of Lithium Niobate on Insulator (LNOI) for Photonic Integrated Circuits

Andreas Boes, Bill Corcoran, Lin Chang et al. · Laser & Photonics Review · 2018 · 703 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Recent Advances and Trends in Advanced Packaging

John H. Lau · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 585 citations

Engineering, Electrical Engineering, Electronic Materials +15

From today's INTRAnet of things to a future INTERnet of things: a wireless- and mobility-related view

Michele Zorzi, Alexander Gluhak, Sebastian Lange et al. · IEEE Wireless Communications · 2010 · 561 citations

Computing, Computer Systems, Information Technology +17

III‐V/silicon photonics for on‐chip and intra‐chip optical interconnects

Günther Roelkens, L. Liu, Di Liang et al. · Laser & Photonics Review · 2010 · 529 citations

Engineering, Electrical Engineering, Materials Science +17

1–5 of 839

Authors

4.4K

JE
John E. Bowers
University of California, Santa Barbara, United States
25 publications · 3K citations
23
h-index
JH
John H. Lau
Industrial Technology Research Institute, Taiwan
21 publications · 1.3K citations
19
h-index
GR
Günther Roelkens
Ghent University, Belgium
23 publications · 1.6K citations
19
h-index
DV
Dries Van Thourhout
Ghent University, Belgium
17 publications · 1.1K citations
14
h-index
CK
Cheng-Ta Ko
Industrial Technology Research Institute, Taiwan
13 publications · 411 citations
13
h-index

1–5 of 4.4K

Institutions

790

1–8 of 790

Venues

IEEE Transactions on Components Packaging and Manufacturing Technology
34 publications · 2K citations
22
h-index
IEEE Journal of Selected Topics in Quantum Electronics
20 publications · 1.3K citations
19
h-index
Optics Express
17 publications · 1.3K citations
16
h-index
Applied Physics Letters
13 publications · 664 citations
13
h-index
IEEE Transactions on Electron Devices
13 publications · 408 citations
12
h-index

1–5