Packaging Reliability Testing

Packaging Reliability Testing is a systematic methodology within MEMS testing that evaluates the long-term structural and functional integrity of microelectromechanical systems under environmental and operational stresses to ensure sustained performance and failure resistance throughout their intended lifecycle.

217

Publications

7.3K

Citations

989

Authors

231

Institutions

Publications per year

2017–2026

Parents

Mems Testing

Publications

217

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports · 2002 · 1.4K citations

Engineering, Materials Engineering, Materials Science +15

Long-Term and Accelerated Life Testing of a Novel Single-Wafer Vacuum Encapsulation for MEMS Resonators

Rob N. Candler, Matthew A. Hopcroft, Bongsang Kim et al. · Journal of Microelectromechanical Systems · 2006 · 205 citations

Engineering, Materials Engineering, Materials Science +17

Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition

Yi‐Shao Lai, Ping‐Feng Yang, Chang-Lin Yeh · Microelectronics Reliability · 2005 · 180 citations

Engineering, Computer Engineering, Packaging Design +14

The efficacy of error mitigation techniques for DRAM retention failures

Samira Khan, Donghyuk Lee, Yoongu Kim et al. · 2014 · 170 citations

Engineering, Computer Engineering, Fault Tolerance +15

Drop impact reliability testing for lead-free and lead-based soldered IC packages

Desmond Y. R. Chong, J.H.L. Pang, Kellin Ng et al. · Microelectronics Reliability · 2005 · 155 citations

Engineering, Electrical Engineering, Materials Science +13

1–5 of 217

Authors

989

HG
Horst Gieser
Fraunhofer Institute for Reliability and Microintegration, Germany
5 publications · 69 citations
5
h-index
YL
Yi‐Shao Lai
Advanced Semiconductor Engineering (Taiwan), Taiwan
5 publications · 333 citations
5
h-index
HW
Heinrich Wolf
Fraunhofer Institute for Reliability and Microintegration, Germany
5 publications · 69 citations
5
h-index
TY
Tong Yan Tee
STMicroelectronics (Singapore), Singapore
4 publications · 289 citations
4
h-index
ZZ
Z.W. Zhong
Nanyang Technological University, Singapore
4 publications · 264 citations
4
h-index

1–5 of 989

Institutions

231

1–8 of 231

Venues

Microelectronics Reliability
35 publications · 1.3K citations
19
h-index
IEEE Transactions on Reliability
7 publications · 121 citations
7
h-index
IEEE Transactions on Components Packaging and Manufacturing Technology
7 publications · 196 citations
7
h-index
IEEE Transactions on Components and Packaging Technologies
6 publications · 106 citations
6
h-index
IEEE Transactions on Components Hybrids and Manufacturing Technology
6 publications · 145 citations
6
h-index

1–5