Concepedia

Flip-chip Bumping

Flip-Chip Bumping is a microfabrication process in semiconductor packaging that involves the deposition of solder or conductive bumps onto the bond pads of a chip, enabling direct electrical and mechanical connection to a substrate through flipped mounting, thereby distinguishing it from wire-bonding techniques by reversing the chip orientation and eliminating the need for fine wires.

273

Publications

7.9K

Citations

859

Authors

197

Institutions

Publications per year

2017–2026

12

Parents

Publications

273

Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization

Woon‐Seop Choi, Everett C. C. Yeh, K. N. Tu · Journal of Applied Physics · 2003 · 232 citations

, , +17

Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization

T. Y. Lee, K. N. Tu, D. R. Frear · Journal of Applied Physics · 2001 · 226 citations

, , +12

Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy

K. N. Tu, Hsiang‐Yao Hsiao, Chih Chen · Microelectronics Reliability · 2012 · 186 citations

, , +15

Recent Advances and New Trends in Flip Chip Technology

John H. Lau · Journal of Electronic Packaging · 2016 · 150 citations

, , +13

Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications

S. K. Kang, Paul Lauro, Da‐Yuan Shih et al. · IBM Journal of Research and Development · 2005 · 149 citations

, , +14

1–5 of 273

Authors

859

  1. JH
    John H. Lau

    Industrial Technology Research Institute, Taiwan

    13 publications · 586 citations

    13

    h-index

  2. HR
    H. Reichl

    Fraunhofer Institute for Reliability and Microintegration, Germany

    16 publications · 409 citations

    13

    h-index

  3. EZ
    E. Zakel

    Technische Universität Berlin, Germany

    10 publications · 188 citations

    10

    h-index

  4. HO
    Hermann Oppermann

    Fraunhofer Institute for Reliability and Microintegration, Germany

    8 publications · 150 citations

    8

    h-index

  5. CC
    Chih Chen

    National Yang Ming Chiao Tung University, Taiwan

    7 publications · 384 citations

    7

    h-index

1–5 of 859

Institutions

197

  1. Fraunhofer Institute for Reliability and Microintegration

    Berlin, Germany

    13 h-index

    74 publications

    1.9K citations

  2. Technische Universität Berlin

    Berlin, Germany

    10 h-index

    18 publications

    483 citations

  3. IBM (United States)

    Armonk, United States

    9 h-index

    41 publications

    1.4K citations

  4. Motorola (United States)

    Schaumburg, United States

    9 h-index

    22 publications

    594 citations

  5. National Yang Ming Chiao Tung University

    Hsinchu, Taiwan

    9 h-index

    27 publications

    1.1K citations

  6. Sungkyunkwan University

    Seoul, South Korea

    8 h-index

    29 publications

    857 citations

  7. Georgia Institute of Technology

    Atlanta, United States

    8 h-index

    22 publications

    427 citations

  8. National Tsing Hua University

    Hsinchu, Taiwan

    7 h-index

    14 publications

    262 citations

1–8 of 197

Venues

  1. Microelectronics Reliability

    18 publications · 766 citations

    15

    h-index

  2. Journal of Electronic Materials

    JEM · 17 publications · 346 citations

    13

    h-index

  3. 12

    h-index

  4. 9

    h-index

  5. IEEE Transactions on Advanced Packaging

    8 publications · 161 citations

    8

    h-index

1–5