Philippe Soussan

Comprehensive analysis of the impact of single and arrays of through silicon vias induced stress on high-k / metal gate CMOS performance

A. Mercha, Geert Van der Plas, Victor Moroz et al. · 2010 · 119 citations

Engineering, Stress Aware Design, Mechanical Engineering +22

A compact, high-speed, and low-cost hyperspectral imager

Nicolaas Tack, Andy Lambrechts, Philippe Soussan et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2012 · 111 citations

Image Sensor, Engineering, Low-cost Hyperspectral Imager +12

Cu/Sn microbumps interconnect for 3D TSV chip stacking

Rahul Agarwal, Wenqi Zhang, Paresh Limaye et al. · 2010 · 96 citations

Engineering, Mechanical Engineering, Computer Architecture +17

Through-silicon via and die stacking technologies for microsystems-integration

Eric Beyne, Piet De Moor, Wouter Ruythooren et al. · 2008 · 86 citations

Engineering, Device Integration, Computer Architecture +16

A CMOS-compatible, integrated approach to hyper- and multispectral imaging

Andy Lambrechts, Pilar Gonzalez, Bert Geelen et al. · 2014 · 66 citations

Image Sensor, Standard Cmos Sensor, Engineering +15