Comprehensive analysis of the impact of single and arrays of through silicon vias induced stress on high-k / metal gate CMOS performance

A. Mercha, Geert Van der Plas, Victor Moroz, +19

EngineeringStress Aware DesignMechanical EngineeringSilicon ViasComputational Mechanics +20

A compact, high-speed, and low-cost hyperspectral imager

Nicolaas Tack, Andy Lambrechts, Philippe Soussan, +1

Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE

Image SensorEngineeringLow-cost Hyperspectral ImagerMicroscopic Wedge FilterImaging Spectroscopy +10

Cu/Sn microbumps interconnect for 3D TSV chip stacking

Rahul Agarwal, Wenqi Zhang, Paresh Limaye, +4

EngineeringMechanical EngineeringComputer ArchitectureInterconnect (Integrated Circuits)Low Temperature Stacking +15

Through-silicon via and die stacking technologies for microsystems-integration

Eric Beyne, Piet De Moor, Wouter Ruythooren, +7

EngineeringDevice IntegrationComputer ArchitectureBiomedical EngineeringMicro-electromechanical System +14

A CMOS-compatible, integrated approach to hyper- and multispectral imaging

Andy Lambrechts, Pilar Gonzalez, Bert Geelen, +3

Image SensorStandard Cmos SensorEngineeringImaging SpectroscopySpectroscopy +13

3-D Wafer-Level Packaging Die Stacking Using Spin-on-Dielectric Polymer Liner Through-Silicon Vias

Yann Civale, Deniz Sabuncuoglu Tezcan, Harold Philipsen, +6

IEEE Transactions on Components Packaging and Manufacturing Technology

EngineeringIntegrated CircuitsTemporary CarriersWafer Scale ProcessingAdvanced Packaging (Semiconductors) +15

Scalable Through Silicon Via with polymer deep trench isolation for 3D wafer level packaging

Deniz Sabuncuoglu Tezcan, Fabrice Duval, Harold Philipsen, +3

EngineeringWafer Scale ProcessingAdvanced Packaging (Semiconductors)Printed ElectronicsElectronic Packaging +17

High-pulse-energy III-V-on-silicon-nitride mode-locked laser

Artur Hermans, Kasper Van Gasse, Jon Kjellman, +13

APL Photonics

Mode-locked LasersPhotonicsEngineeringLaser ScienceApplied Physics +6

Effect of substrate charging on the reliability of capacitive RF MEMS switches

P. Czarnecki, Xavier Rottenberg, Philippe Soussan, +8

Sensors and Actuators A Physical

Electrical EngineeringEngineeringMicroelectronicsMicrowave EngineeringMicro-electromechanical System +1

Grating devices on a silicon nitride technology platform for visible light applications

Jeong Hwan Song, Tangla D. Kongnyuy, Benedetto Troia, +4

OSA Continuum

Transient GratingOptical MaterialsEngineeringMicro-optical ComponentGrating Couplers +17