IEEE Transactions on Nuclear Science · 2019 · 133 citations · 19 references
EngineeringElectrical EngineeringPhysicsElectronic MaterialsMicroelectronicsSemiconductor DevicesDevice ModelingDevice ReliabilityIon ImplantationRadiation Damage In MaterialsSemiconductor ReliabilityWide Band Gap SemiconductorsAvalanche BreakdownBreakdown MechanismsGate Leakage CurrentGate Oxide DegradationGate Oxide LeakageJunction BreakdownLeakage CurrentSchottky Barrier Diodes
Heavy-ion data suggest that a common mechanism is responsible for single-event burnout (SEB) in 1200-V power MOSFETs and junction barrier Schottky (JBS) diodes. Similarly, heavy-ion data suggest a common mechanism is also responsible for leakage current degradation in both devices. This mechanism, based on ion-induced, highly localized energy pulses, is demonstrated in simulations and shown to be capable of causing degradation and SEB for both the MOSFETs and JBS diodes.
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Ionization rates and critical fields in 4H silicon carbide
Andrey O. Konstantinov, Q. Wahab, N. Nordell et al. · Applied Physics Letters · 1997 · 398 citations
Single-Event Burnout Mechanisms in SiC Power MOSFETs
Arthur F. Witulski, Dennis R. Ball, K.F. Galloway et al. · IEEE Transactions on Nuclear Science · 2018 · 179 citations · Full text