Design of new passive THZ devices based on micromachining techniques

Abstract

We present an overview on the latest results using micromachining techniques for the fabrication of THz-components. Different machining techniques was discussed with respect to their capability to generate complex 3-dimensional geometries with high aspect ratios and to meet the high mechanical requirements for THz-components. Exemplary results for the application of micromachining techniques for the design of new components were reviewed. We emphasizes the potential of silicon based microstructures for the manufacturing of new devices.