Publication | Closed Access
Plasma Resistance and Etch Mechanism of High Purity SiC under Fluorocarbon Plasma
19
Citations
18
References
2012
Year
Materials ScienceFluorocarbon PlasmaPlasma ResistanceEngineeringNanoelectronicsApplied PhysicsHigh Purity SicGas Discharge PlasmaPlasma EtchingPlasma ProcessingCarbide
| Year | Citations | |
|---|---|---|
2002 | 510 | |
Study of the SiO2-to-Si3N4 etch selectivity mechanism in inductively coupled fluorocarbon plasmas and a comparison with the SiO2-to-Si mechanism M. Schaepkens, T. E. F. M. Standaert, N. R. Rueger, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films Selective EtchingEngineeringIntegrated CircuitsChemistrySilicon On Insulator | 1999 | 303 |
2003 | 275 | |
1997 | 250 | |
2001 | 123 | |
2000 | 115 | |
2003 | 91 | |
2011 | 78 | |
2001 | 76 | |
2002 | 72 |
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