A study in flip-chip UBM/bump reliability with effects of SnPb solder composition

Electromigration in thin aluminum films on titanium nitride

I. A. Blech · Journal of Applied Physics · 1976 · 1.2K citations

Materials Science, Electrical Engineering, Thin Aluminum Films +13

Copper interconnections and reliability

C.‐K. Hu, J. M. E. Harper · Materials Chemistry and Physics · 1998 · 280 citations

Reliability, Electrical Engineering, Reliability Engineering +8

Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization

Woon‐Seop Choi, Everett C. C. Yeh, K. N. Tu · Journal of Applied Physics · 2003 · 231 citations

Engineering, Mean-time-to-failure Study, Solder Bump +18

Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization

T. Y. Lee, K. N. Tu, D. R. Frear · Journal of Applied Physics · 2001 · 226 citations

Materials Engineering, Materials Science, Electrical Engineering +15

Electromigration of eutectic SnPb solder interconnects for flip chip technology

T. Y. Lee, K. N. Tu, S.-M. Kuo et al. · Journal of Applied Physics · 2001 · 181 citations

Materials Science, Advanced Packaging, Electrical Engineering +15