J.D. Wu

Fracture strength characterization and failure analysis of silicon dies

J.D. Wu, C.-Y. Huang, C.C. Liao · Microelectronics Reliability · 2003 · 70 citations

Engineering, Materials Engineering, Materials Science +15

A study in flip-chip UBM/bump reliability with effects of SnPb solder composition

J.D. Wu, P.J. Zheng, C.W. Lee et al. · Microelectronics Reliability · 2005 · 55 citations

Engineering, Electrical Engineering, Materials Science +17

Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array

Tong Hong Wang, Yi‐Shao Lai, J.D. Wu · Journal of Electronic Packaging · 2004 · 33 citations

Engineering, Materials Engineering, Materials Science +17

High-G drop impact response and failure analysis of a chip packaged printed circuit board

S.T. Jenq, Haw-Yang Sheu, Chang-Lin Yeh et al. · International Journal of Impact Engineering · 2006 · 32 citations

Engineering, Electrical Engineering, Mechanical Behavior Of Materials +14

An experimental study of failure and fatigue life of a stacked CSP subjected to cyclic bending

J.D. Wu, Seong Ho, P.J. Zheng et al. · 2002 · 23 citations

Engineering, Materials Engineering, Materials Science +17