Tong Hong Wang - Concepedia

Author

Tong Hong Wang

Advanced Semiconductor Engineering (Taiwan)

Also Known As

Tong Hong Wang

Publications

645

Citations

H-Index

Concepts

All Affiliations

Advanced Semiconductor Engineering (Taiwan)National Cheng Kung University National Formosa University Southern Taiwan University of Science and Technology

About

Tong Hong Wang is an author at Advanced Semiconductor Engineering (Taiwan) specializing in engineering, electronic packaging, and mechanical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	13	19	421
2	Applied Physics	3	3	103
3	Health Sciences	1	1	62
4	Medicine	1	1	62
5	Cell Biology	1	1	62

Tong Hong Wang

Publications

533

Citations

H-Index

Page 1

	Year	Citations
A numerical study of factors affecting the characterization of nanoindentation on silicon Tong Hong Wang, Te‐Hua Fang, Yu-Cheng Lin Materials Science and Engineering A Materials ScienceNumerical StudyEngineeringMicrofabricationNanotechnology	2006	77
Andrographolide impedes cancer stemness and enhances radio-sensitivity in oral carcinomas via miR-218 activation Po-Yu Yang, Pei‐Ling Hsieh, Tong Hong Wang, Oncotarget Mir-218 ActivationPathologyCancer BiologyTumor BiologyOral Cancer	2016	62
Cyclic bending reliability of wafer-level chip-scale packages Yi‐Shao Lai, Tong Hong Wang, Han-Hui Tsai, Microelectronics Reliability Reliability EngineeringEngineeringChip-scale PackageFlexible ElectronicsAdvanced Packaging (Semiconductors)	2006	33
Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array Tong Hong Wang, Yi‐Shao Lai, J.D. Wu Journal of Electronic Packaging Thermal Fatigue FailureEngineeringHigh Temperature MaterialsMechanical BehaviorMechanics	2004	33
Optimization of Thermomechanical Reliability of Board-level Package-on-Package Stacking Assembly Yi‐Shao Lai, Tong Hong Wang, Ching-Chun Wang IEEE Transactions on Components and Packaging Technologies Thermomechanical ReliabilityEngineeringMultidisciplinary Design OptimizationMechanical EngineeringOptimal System Design	2006	31
Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly Yi‐Shao Lai, Tong Hong Wang Microelectronics Reliability ReliabilityReliability EngineeringEngineeringChip-scale PackageAdvanced Packaging (Semiconductors)	2004	29
Optimal design towards enhancement of board-level thermomechanical reliability of wafer-level chip-scale packages Yi‐Shao Lai, Tong Hong Wang Microelectronics Reliability Reliability EngineeringEngineeringChip-scale PackageAdvanced Packaging (Semiconductors)Microfabrication	2006	29
Mechanical characterization of nanoindented graphene via molecular dynamics simulations Te‐Hua Fang, Tong Hong Wang, Jhih-Chin Yang, Nanoscale Research Letters	2011	26
Submodeling Analysis for Path-Dependent Thermomechanical Problems Tong Hong Wang, Yi‐Shao Lai Journal of Electronic Packaging EngineeringValid Submodeling AnalysisMechanical EngineeringPath-dependent Thermomechanical ProblemsStructural Optimization	2004	24
Thermal–Mechanical Coupling Analysis for Coupled Power- and Thermal-Cycling Reliability of Board-Level Electronic Packages Yi-Shao Lai, Tong Hong Wang, Chang-Chi Lee IEEE Transactions on Device and Materials Reliability EngineeringMechanical EngineeringPower Electronic SystemsBoard-level Electronic PackagesTest Vehicle	2008	20

Page 1