Tong Hong Wang

Publications

533

Citations

H-Index

2004

Active since

Affiliations

Advanced Semiconductor Engineering (Taiwan)(Current)

National Cheng Kung University

National Formosa University

Southern Taiwan University of Science and Technology

Tong Hong Wang is an author at Advanced Semiconductor Engineering (Taiwan) specializing in engineering, electronic packaging, and mechanical engineering.

Top concepts

EngineeringElectronic PackagingMechanical EngineeringThermal EngineeringMicroelectronicsHeat TransferReliability EngineeringComputer EngineeringMechanics Of MaterialsElectrical Engineering

Publications per year

2004–2016

Publications

A numerical study of factors affecting the characterization of nanoindentation on silicon

Tong Hong Wang, Te‐Hua Fang, Yu-Cheng Lin · Materials Science and Engineering A · 2006 · 77 citations

Materials Science, Numerical Study, Engineering +9

Andrographolide impedes cancer stemness and enhances radio-sensitivity in oral carcinomas via miR-218 activation

Po-Yu Yang, Pei‐Ling Hsieh, Tong Hong Wang et al. · Oncotarget · 2016 · 62 citations · Full text

Mir-218 Activation, Pathology, Cancer Biology +18

Cyclic bending reliability of wafer-level chip-scale packages

Yi‐Shao Lai, Tong Hong Wang, Han-Hui Tsai et al. · Microelectronics Reliability · 2006 · 33 citations

Reliability Engineering, Engineering, Chip-scale Package +8

Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array

Tong Hong Wang, Yi‐Shao Lai, J.D. Wu · Journal of Electronic Packaging · 2004 · 33 citations

Thermal Fatigue Failure, Engineering, High Temperature Materials +15

Optimization of Thermomechanical Reliability of Board-level Package-on-Package Stacking Assembly

Yi‐Shao Lai, Tong Hong Wang, Ching-Chun Wang · IEEE Transactions on Components and Packaging Technologies · 2006 · 31 citations

Thermomechanical Reliability, Engineering, Multidisciplinary Design Optimization +16

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