Ching-Chun Wang

A 256/spl times/256 CMOS differential passive pixel imager with FPN reduction techniques

Iliana L. Fujimori, Ching-Chun Wang, C.G. Sodini · IEEE Journal of Solid-State Circuits · 2000 · 36 citations

Engineering, Analog-to-digital Converter, Data Converter +11

Optimization of Thermomechanical Reliability of Board-level Package-on-Package Stacking Assembly

Yi‐Shao Lai, Tong Hong Wang, Ching-Chun Wang · IEEE Transactions on Components and Packaging Technologies · 2006 · 31 citations

Thermomechanical Reliability, Engineering, Multidisciplinary Design Optimization +16

Examination of board-level drop reliability of package-on-package stacking assemblies of different structural configurations

Yi‐Shao Lai, Chang-Lin Yeh, Ching-Chun Wang · Microelectronic Engineering · 2006 · 23 citations

Reliability, Board-level Drop Reliability, Structural Integrity +11

Optimization of board-level thermomechanical reliability of high performance flip-chip package assembly

Tong Hong Wang, Ching-Chun Wang, Yi‐Shao Lai et al. · Microelectronic Engineering · 2008 · 14 citations

Chip-scale Package, Engineering, Advanced Packaging (Semiconductors) +9

Investigations of Board-Level Drop Reliability of Wafer-Level Chip-Scale Packages

Yi‐Shao Lai, Chang-Lin Yeh, Ching-Chun Wang · Journal of Electronic Packaging · 2006 · 12 citations

Reliability, Electrical Engineering, Reliability Engineering +14