Concepedia
Microelectronics Reliability · 2006 · 33 citations · 13 references
EngineeringMaterials ScienceMechanical Behavior Of MaterialsPackaging DesignChip PackagingDevice ReliabilityPackaging EngineeringReliability-based DesignSemiconductor ReliabilityWafer BondingChip-scale PackagingPackage ReliabilityWafer-level Packaging
13
Effect of simulation methodology on solder joint crack growth correlation
Robert Darveaux · 2002 · 535 citations
Engineering, Materials Engineering, Materials Science +17
Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction
Robert Darveaux · Journal of Electronic Packaging · 2002 · 285 citations
Predicting solder joint reliability for thermal, power, and bend cycle within 25% accuracy
A. Syed · 2002 · 125 citations
Rate dependent constitutive relations based on Anand model for 92.5Pb5Sn2.5Ag solder
Jürgen Wilde, Karl‐Friedrich Becker, M. Thoben et al. · IEEE Transactions on Advanced Packaging · 2000 · 120 citations
Natural Sciences, Materials Engineering, Materials Science +17
Time-independent elastic–plastic behaviour of solder materials
Steffen Wiese, Sven Rzepka · Microelectronics Reliability · 2004 · 83 citations
Natural Sciences, Materials Engineering, Materials Science +14