Hafnium zirconate gate dielectric for advanced gate stack applications

Abstract

We report on the development of a hafnium zirconate (HfZrO4) alloy gate dielectric for advanced gate stack applications. The HfZrO4 and hafnium dioxide (HfO2) films were formed by atomic layer deposition using metal halides and heavy water as precursors. The HfZrO4 material properties were examined and compared with those of HfO2 by a wide variety of analytical methods. The dielectric properties, device performance, and reliability of HfZrO4 were investigated by fabricating HfZrO4/tantalum carbide (TaxCy) metal-oxide-semiconductor field effect transistor. The HfZrO4 dielectric film has smaller band gap, smaller and more uniform grains, less charge traps, and more uniform film quality than HfO2. The HfZrO4 dielectric films exhibited good thermal stability with silicon. Compared to HfO2, the HfZrO4 gate dielectric showed lower capacitance equivalent thickness value, higher transconductance, less charge trapping, higher drive current, lower threshold voltage (Vt), reduced capacitance-voltage (C-V) hysteresis, lower interface state density, superior wafer level thickness uniformity, and longer positive bias temperature instability lifetime. Incorporation of zirconium dioxide (ZrO2) into HfO2 enhances the dielectric constant (k) of the resulting HfZrO4 which is associated with structural phase transformation from mainly monoclinic to tetragonal. The tetragonal phase increases the k value of HfZrO4 dielectric to a large value as predicted. The improved device characteristics are attributed to less oxygen vacancy in the fine grained microstructure of HfZrO4 films.