Concepedia

Interposer Integration

Interposer Integration is a packaging method in microelectromechanical systems (MEMS) that incorporates an intermediate substrate to enable electrical interconnection and mechanical support between the MEMS die and the external package, distinguished by its role in enhancing signal integrity and facilitating heterogeneous integration.

182

Publications

6K

Citations

1K

Authors

149

Institutions

Publications per year

2017–2026

65

Parents

Publications

182

Wafer-Level Integration of an Advanced Logic-Memory System Through the Second-Generation CoWoS Technology

S. Y. Hou, W. Chris Chen, Clark Hu et al. · IEEE Transactions on Electron Devices · 2017 · 216 citations

, , +15

Advanced reliability study of TSV interposers and interconnects for the 28nm technology FPGA

Bahareh Banijamali, Suresh Ramalingam, K. V. Nagarajan et al. · 2011 · 179 citations

, , +17

Enabling interposer-based disintegration of multi-core processors

Ajaykumar Kannan, Natalie Enright Jerger, Gabriel H. Loh · 2015 · 171 citations · Full text

, , +17

Assembly and reliability challenges in 3D integration of 28nm FPGA die on a large high density 65nm passive interposer

Raghunandan Chaware, K. V. Nagarajan, Suresh Ramalingam · 2012 · 142 citations

, , +17

Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package

Xiaowu Zhang, T.C. Chai, John H. Lau et al. · 2009 · 109 citations

, , +17

1–5 of 182

Authors

1K

  1. JH
    John H. Lau

    Industrial Technology Research Institute, Taiwan

    15 publications · 641 citations

    14

    h-index

  2. CZ
    Chau‐Jie Zhan

    Industrial Technology Research Institute, Taiwan

    8 publications · 191 citations

    8

    h-index

  3. CL
    Ching-Kuan Lee

    Industrial Technology Research Institute, Taiwan

    8 publications · 191 citations

    8

    h-index

  4. SY
    S. Y. Hou

    Taiwan Semiconductor Manufacturing Company (Taiwan), Taiwan

    7 publications · 503 citations

    7

    h-index

  5. CC
    Chun-Hsien Chien

    Industrial Technology Research Institute, Taiwan

    7 publications · 181 citations

    7

    h-index

1–5 of 1K

Institutions

149

  1. Industrial Technology Research Institute

    Hsinchu, Taiwan

    15 h-index

    184 publications

    4.6K citations

  2. Taiwan Semiconductor Manufacturing Company (Taiwan)

    Hsinchu, Taiwan

    14 h-index

    145 publications

    7.4K citations

  3. Agency for Science, Technology and Research

    Singapore, Singapore

    11 h-index

    85 publications

    2.9K citations

  4. Georgia Institute of Technology

    Atlanta, United States

    11 h-index

    56 publications

    2.3K citations

  5. Institute of Microelectronics

    Singapore, Singapore

    10 h-index

    67 publications

    2.6K citations

  6. Samsung (South Korea)

    Seoul, South Korea

    10 h-index

    76 publications

    1.9K citations

  7. Xilinx (United States)

    San Jose, United States

    8 h-index

    26 publications

    1.7K citations

  8. Corning (United States)

    Corning, United States

    7 h-index

    17 publications

    435 citations

1–8 of 149

Venues

  1. 13

    h-index

  2. IMAPSource Proceedings

    6 publications · 132 citations

    6

    h-index

  3. IEEE Electron Device Letters

    3 publications · 66 citations

    4

    h-index

  4. 3

    h-index

  5. IEEE Transactions on Advanced Packaging

    3 publications · 156 citations

    3

    h-index

1–5