Clark Hu

Publications

487

Citations

H-Index

2013

Active since

Affiliations

Taiwan Semiconductor Manufacturing Company (Taiwan)(Current)

Clark Hu is an author at Taiwan Semiconductor Manufacturing Company (Taiwan) specializing in electronic packaging, computer architecture, and computer engineering.

Top concepts

EngineeringMicroelectronicsComputer EngineeringElectronic PackagingComputer ArchitectureIntegrated CircuitsElectrical Engineering3D IntegrationMicrofabricationAdvanced Packaging

Publications per year

2013–2021

Publications

Wafer-Level Integration of an Advanced Logic-Memory System Through the Second-Generation CoWoS Technology

S. Y. Hou, W. Chris Chen, Clark Hu et al. · IEEE Transactions on Electron Devices · 2017 · 202 citations

Engineering, Vlsi Design, Device Integration +23

Wafer Level System Integration of the Fifth Generation CoWoS®-S with High Performance Si Interposer at 2500 mm2

P. K. Huang, Chin‐Wei Lu, Wen-En Wei et al. · 2021 · 79 citations

Artificial Intelligence, Engineering, Device Integration +18

3D Multi-chip Integration with System on Integrated Chips (SoIC™)

Clark Hu, M.F. Chen, W.C. Chiou et al. · 2019 · 68 citations

Engineering, Device Integration, Finfet Technology +20

Reliability evaluation of a CoWoS-enabled 3D IC package

Bahareh Banijamali, Chien‐Chia Chiu, Cheng‐Chieh Hsieh et al. · 2013 · 64 citations

Engineering, Mechanical Engineering, Computer Architecture +19

SoIC for Low-Temperature, Multi-Layer 3D Memory Integration

M. F. Chen, C. S. Lin, E.B. Liao et al. · 2020 · 48 citations

Memory Cube Integration, Engineering, Computer Architecture +19

Rows per page

1–5 of 6