Concepedia

3D Multi-chip Integration with System on Integrated Chips (SoIC™)

Clark Hu, M.F. Chen, W.C. Chiou, Doug C. H. Yu

2019 · 68 citations · 8 references

Abstract

The electrical characterization of System on Integrated Chips (SoIC™), an innovative 3D heterogeneous integration technology manufactured in front-end of line with known-good-die is reported. Chiplets integration of devices including foundry leading edge 7nm FinFET technology with SoIC™ illustrates its advantages in high bandwidth density and high power efficiency, as compared with 2.5D and conventional 3D-IC with micro-bump/TSV.

References

8

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Engineering, Computer Engineering, Electrical Engineering +13

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Engineering, Computer Engineering, Electrical Engineering +17

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Engineering, Computer Engineering, Electrical Engineering +17

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Engineering, Computer Engineering, Electrical Engineering +16