Publication | Closed Access
3D Multi-chip Integration with System on Integrated Chips (SoIC™)
68
Citations
8
References
2019
Year
Unknown Venue
EngineeringDevice IntegrationFinfet TechnologyComputer ArchitectureIntegrated CircuitsInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)Heterogeneous IntegrationMulti-chip IntegrationChiplets IntegrationIntegrated Circuit DesignElectronic Packaging3D Ic ArchitectureElectrical EngineeringChip On BoardComputer EngineeringIntegrated ChipsChip AttachmentMicroelectronicsAdvanced PackagingThree-dimensional Heterogeneous IntegrationThree-dimensional Integrated Circuits3D Integration
The electrical characterization of System on Integrated Chips (SoIC™), an innovative 3D heterogeneous integration technology manufactured in front-end of line with known-good-die is reported. Chiplets integration of devices including foundry leading edge 7nm FinFET technology with SoIC™ illustrates its advantages in high bandwidth density and high power efficiency, as compared with 2.5D and conventional 3D-IC with micro-bump/TSV.
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