Statistics
Publications
22
Citations
1.4K
H-Index
17
Active since
2008
Doug C. H. Yu is an author at Taiwan Semiconductor Manufacturing Company (Taiwan) specializing in chip packaging, engineering, and electrical engineering.
Publications per year
2008–2021
22
22
System on Integrated Chips (SoIC(TM) for 3D Heterogeneous Integration
Ming-Fa Chen, Fang-Cheng Chen, Wen-Chih Chiou et al. · 2019 · 179 citations
Engineering, Computer Engineering, Electrical Engineering +17
Vertical interconnects of microbumps in 3D integration
Chih Chen, Doug C. H. Yu, Kuan‐Neng Chen · MRS Bulletin · 2015 · 105 citations · Full text
Engineering, Computer Engineering, Electrical Engineering +12
High density 3D integration using CMOS foundry technologies for 28 nm node and beyond
Jason Lin, W.C. Chiou, K.F. Yang et al. · 2010 · 70 citations
3D Multi-chip Integration with System on Integrated Chips (SoIC™)
Clark Hu, M.F. Chen, W.C. Chiou et al. · 2019 · 68 citations
Engineering, Computer Engineering, Electrical Engineering +17
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