K.F. Yang

High density 3D integration using CMOS foundry technologies for 28 nm node and beyond

Jason Lin, W.C. Chiou, K.F. Yang et al. · 2010 · 70 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +26

Enabling 3D-IC foundry technologies for 28 nm node and beyond: through-silicon-via integration with high throughput die-to-wafer stacking

D.Y. Chen, W.C. Chiou, M.F. Chen et al. · 2009 · 47 citations

Engineering, Computer Architecture, Integrated Circuits +21

Complementary Field-Effect Transistor (CFET) Demonstration at 48nm Gate Pitch for Future Logic Technology Scaling

Siyong Liao, T.K. Chiu, Wei-Xiang You et al. · 2023 · 47 citations

Complementary Field-effect Transistor, Electrical Engineering, Engineering +12

Dispatching in semiconductor fabs with machine-dedication features

Muh-Cherng Wu, Yu-Ju Huang, Yung-Chia Chang et al. · The International Journal of Advanced Manufacturing Technology · 2006 · 45 citations

Electrical Engineering, Engineering, Circuit Design +5

TSV process optimization for reduced device impact on 28nm CMOS

C.L. Yu, Chih‐Yung Chang, Hung-En Wang et al. · 2011 · 25 citations

Low-power Electronics, 3D Ic Architecture, Electrical Engineering +13