E.B. Liao

Development of 3-D Silicon Module With TSV for System in Packaging

Navas Khan, V. S. Rao, Sharon Pei-Siang Lim et al. · IEEE Transactions on Components and Packaging Technologies · 2010 · 120 citations

Engineering, Electrical Engineering, Materials Engineering +17

Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package

Xiaowu Zhang, T.C. Chai, John H. Lau et al. · 2009 · 109 citations

Engineering, Computer Engineering, Electrical Engineering +17

High density 3D integration using CMOS foundry technologies for 28 nm node and beyond

Jason Lin, W.C. Chiou, K.F. Yang et al. · 2010 · 70 citations

Engineering, Computer Engineering, Digital Fabrication +16

Evaluation of bonding between oxygen plasma treated polydimethyl siloxane and passivated silicon

Kum Cheong Tang, E.B. Liao, Wee‐Liat Ong et al. · Journal of Physics Conference Series · 2006 · 70 citations · Full text

Engineering, Materials Engineering, Materials Science +14

Development of Large Die Fine-Pitch Cu/Low-$k$ FCBGA Package With Through Silicon via (TSV) Interposer

Tai Chong Chai, Xiaowu Zhang, John H. Lau et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 55 citations

Engineering, Electrical Engineering, Electronic Materials +16