N. Jourdan

Reliability study on cobalt and ruthenium as alternative metals for advanced interconnects

Olalla Varela Pedreira, Kristof Croes, A. Leśniewska et al. · 2017 · 77 citations

Reliability Study, Engineering, Beol Interconnects +17

Damascene Benchmark of Ru, Co and Cu in Scaled Dimensions

Marleen H. van der Veen, N. Heyler, Olalla Varela Pedreira et al. · 2018 · 58 citations

Engineering, Damascene Benchmark, Geologic Time Scale +17

Implementation of an industry compliant, 5×50μm, via-middle TSV technology on 300mm wafers

A. Redolfi, Dimitrios Velenis, Sarasvathi Thangaraju et al. · 2011 · 52 citations

Engineering, Silicon Vias, Integrated Circuits +18

Heavily doped GaAs(Be)/GaAlAs HBTs grown by MBE with high device performances and high thermal stability

N. Jourdan, F. Alexandre, C. Dubon‐Chevallier et al. · IEEE Transactions on Electron Devices · 1992 · 33 citations

Wide-bandgap Semiconductor, High Thermal Stability, Electrical Engineering +15

Inflection points in interconnect research and trends for 2nm and beyond in order to solve the RC bottleneck

Zs. Tôkei, V. Vega, Gayle Murdoch et al. · 2020 · 29 citations

Engineering, Vlsi Design, Interconnection Network Architecture +24