Publication | Closed Access
Inflection points in interconnect research and trends for 2nm and beyond in order to solve the RC bottleneck
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2020
Year
Unknown Venue
EngineeringVlsi DesignInterconnection Network ArchitectureInflection PointsInterconnect (Integrated Circuits)Rc BottleneckWafer Scale ProcessingAdvanced Packaging (Semiconductors)NanoelectronicsSuperconductivityElectronic PackagingElectronic CircuitMaterials ScienceMaterials EngineeringElectrical EngineeringInterconnect OptionsHybrid MetallizationMetallurgical InteractionComputer EngineeringInterconnection NetworkMicroelectronicsInterconnect ResearchSurface ScienceCondensed Matter PhysicsApplied PhysicsInterface StructureSemi-damascene Interconnects
Interconnect options will be introduced and reviewed targeting tight pitch metal layers at the local levels. Examples include hybrid metallization, semi-damascene interconnects as well as potential new conductor materials.