Mechanical reliability of Cu cored solder ball in flip chip package under thermal shock test

Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni

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Natural Sciences, Materials Engineering, Materials Science +13

A viable tin-lead solder substitute: Sn-Ag-Cu

Chad M. Miller, Iver E. Anderson, Jack Smith · Journal of Electronic Materials · 1994 · 261 citations

Natural Sciences, Materials Engineering, Materials Science +9

Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders

H. Mavoori, Jason Chin, Semyon Vaynman et al. · Journal of Electronic Materials · 1997 · 235 citations

Natural Sciences, Materials Engineering, Materials Science +16

Effects of Ag content on fracture resistance of Sn–Ag–Cu lead-free solders under high-strain rate conditions

Daewoong Suh, Dong Wook Kim, Pilin Liu et al. · Materials Science and Engineering A · 2007 · 156 citations

Natural Sciences, Materials Engineering, Materials Science +16

Mechanism of electromigration-induced failure in the 97Pb–3Sn and 37Pb–63Sn composite solder joints

Jae-Woong Nah, Kyung W. Paik, Jong-ook Suh et al. · Journal of Applied Physics · 2003 · 140 citations

Natural Sciences, Materials Engineering, Materials Science +15