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Effects of Ag content on fracture resistance of Sn–Ag–Cu lead-free solders under high-strain rate conditions

DOI

155

Citations

9

References

2007

Year

Daewoong Suh, Dong Wook Kim, Pilin Liu, Hyunchul Kim, Jessica Weninger, Chetan Kumar, Aparna Prasad, Brian W. Grimsley, Hazel B. Tejada
Materials Science and Engineering A

References

YearCitations

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