Pilin Liu

Effects of Ag content on fracture resistance of Sn–Ag–Cu lead-free solders under high-strain rate conditions

Daewoong Suh, Dong Wook Kim, Pilin Liu et al. · Materials Science and Engineering A · 2007 · 156 citations

Natural Sciences, Materials Engineering, Materials Science +16

The material optimization and reliability characterization of an indium-solder thermal interface material for CPU packaging

Carl Deppisch, Thomas J. Fitzgerald, Arun Raman et al. · JOM · 2006 · 88 citations

Engineering, Materials Engineering, Materials Science +17

Improved Drop Reliability Performance with Lead Free Solders of Low Ag Content and Their Failure Modes

Hyunchul Kim, Mu Zhang, Chetan Kumar et al. · 2007 · 78 citations

Engineering, Materials Engineering, Materials Science +17

Concurrent electromigration and creep in lead-free solder

Matt Pharr, Kejie Zhao, Zhigang Suo et al. · Journal of Applied Physics · 2011 · 40 citations · Full text

Natural Sciences, Electrical Engineering, Materials Science +12

Enabling Hybrid Bonding on Intel Process

Adel Elsherbini, Kimin Jun, Richard Vreeland et al. · 2021 IEEE International Electron Devices Meeting (IEDM) · 2021 · 33 citations

Engineering, Computer Engineering, Electrical Engineering +17