Concepedia

Carl Deppisch

CD

2

Publications

98

Citations

2

H-Index

2005

Active since

Affiliations

Intel (United States)(Current)

Carl Deppisch is an author at Intel (United States) specializing in microelectronics, electronic packaging, and electrical engineering.

Top concepts

Publications per year

2005–2006

2

Publications

2

The material optimization and reliability characterization of an indium-solder thermal interface material for CPU packaging

Carl Deppisch, Thomas J. Fitzgerald, Arun Raman et al. · JOM · 2006 · 87 citations

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Novel Process Techniques to Reduce Voids in Solder Thermal Interface Materials Used for Flip-Chip Package Applications

Marcelo Montaño, J. Garay Garcia, Weimin Shi et al. · 2005 · 11 citations

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