Concepedia

Haksan Jeong

HJ

Statistics

Publications

8

Citations

155

H-Index

8

Active since

2018

Affiliations

Sungkyunkwan University(Current)

Samsung (South Korea)

Haksan Jeong is an author at Sungkyunkwan University specializing in engineering, materials science, and electronic packaging.

Top concepts

EngineeringMaterial ScienceElectronic PackagingMicroelectronicsMechanical EngineeringHeat TransferThermal EngineeringMaterials EngineeringElectrical EngineeringCorrosion

Publications per year

2018–2020

8

Publications

8

Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages

Kwang‐Ho Jung, Kyung Deuk Min, Choong-Jae Lee et al. · Applied Surface Science · 2019 · 35 citations

Materials Science, Chemical Engineering, Engineering +8

Ultrafast Photonic Soldering with Sn–58Bi Using Intense Pulsed Light Energy

Kwang‐Ho Jung, Kyung Deuk Min, Choong-Jae Lee et al. · Advanced Engineering Materials · 2020 · 23 citations

Optical Materials, Engineering, Laser Science +22

Effect of epoxy mold compound and package dimensions on the thermomechanical properties of a fan-out package

Haksan Jeong, Kwang‐Ho Jung, Choong-Jae Lee et al. · Journal of Materials Science Materials in Electronics · 2020 · 22 citations

Materials Science, Engineering, Mechanical Engineering +13

Mechanical Reliability of the Epoxy Sn-58wt.%Bi Solder Joints with Different Surface Finishes Under Thermal Shock

Yong-Gue Sung, Woo‐Ram Myung, Haksan Jeong et al. · Journal of Electronic Materials · 2018 · 19 citations

Materials Engineering, Materials Science, Different Surface Finishes +9

Mechanical reliability of Cu cored solder ball in flip chip package under thermal shock test

Haksan Jeong, Kyung Deuk Min, Choong-Jae Lee et al. · Microelectronics Reliability · 2020 · 16 citations

Materials Science, Engineering, Advanced Packaging (Semiconductors) +12

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