Choong-Jae Lee

Mechanical properties of Sn-58 wt%Bi solder containing Ag-decorated MWCNT with thermal aging tests

Choong-Jae Lee, Kyung Deuk Min, Hyun Joon Park et al. · Journal of Alloys and Compounds · 2019 · 43 citations

Materials Science, Materials Engineering, Electrical Engineering +10

Intense pulsed light surface treatment for improving adhesive bonding of aluminum and carbon fiber reinforced plastic (CFRP)

Jae-Ha Kim, Choong-Jae Lee, Kyung Deuk Min et al. · Composite Structures · 2020 · 40 citations

Materials Science, Fibre-reinforced Plastic, Engineering +8

Mechanical, electrical, and thermal reliability of Sn-58wt.%Bi solder joints with Ag-decorated MWCNT for LED package component during aging treatment

Bum-Geun Park, Woo‐Ram Myung, Choong-Jae Lee et al. · Composites Part B Engineering · 2019 · 37 citations

Materials Engineering, Materials Science, Electrical Engineering +11

Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages

Kwang‐Ho Jung, Kyung Deuk Min, Choong-Jae Lee et al. · Applied Surface Science · 2019 · 35 citations

Materials Science, Chemical Engineering, Engineering +8

Electromigration behaviors of Sn58%Bi solder containing Ag-coated MWCNTs with OSP surface finished PCB

Jungsoo Kim, Kwang‐Ho Jung, Jae-Ha Kim et al. · Journal of Alloys and Compounds · 2018 · 30 citations

Materials Engineering, Materials Science, Electrical Engineering +10