Woo‐Ram Myung

Mechanical property of the epoxy-contained Sn–58Bi solder with OSP surface finish

Woo‐Ram Myung, Yongil Kim, Seung‐Boo Jung · Journal of Alloys and Compounds · 2014 · 57 citations

Materials Science, Engineering, Mechanical Engineering +5

Mechanical, electrical, and thermal reliability of Sn-58wt.%Bi solder joints with Ag-decorated MWCNT for LED package component during aging treatment

Bum-Geun Park, Woo‐Ram Myung, Choong-Jae Lee et al. · Composites Part B Engineering · 2019 · 37 citations

Materials Engineering, Materials Science, Electrical Engineering +11

Effects of Ag content on the reliability of LED package component with Sn–Bi–Ag solder

Woo‐Ram Myung, Min-Kwan Ko, Yongil Kim et al. · Journal of Materials Science Materials in Electronics · 2015 · 31 citations

Electrical Engineering, Solid-state Lighting, Ag Content +5

Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test

Woo‐Ram Myung, Yongil Kim, Kyung-Yeol Kim et al. · Journal of Electronic Materials · 2016 · 30 citations

Materials Engineering, Materials Science, Electrical Engineering +8

Effect of epoxy mold compound and package dimensions on the thermomechanical properties of a fan-out package

Haksan Jeong, Kwang‐Ho Jung, Choong-Jae Lee et al. · Journal of Materials Science Materials in Electronics · 2020 · 22 citations

Materials Science, Engineering, Mechanical Engineering +13