Bum-Geun Park

Mechanical, electrical, and thermal reliability of Sn-58wt.%Bi solder joints with Ag-decorated MWCNT for LED package component during aging treatment

Bum-Geun Park, Woo‐Ram Myung, Choong-Jae Lee et al. · Composites Part B Engineering · 2019 · 37 citations

Materials Engineering, Materials Science, Electrical Engineering +11

Photo-induced fabrication of Ag nanowire circuitry for invisible, ultrathin, conformable pressure sensors

Chul Jong Han, Bum-Geun Park, Min Suk Oh et al. · Journal of Materials Chemistry C · 2017 · 36 citations

Engineering, Flexible Sensor, Electronic Devices +20

Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages

Kwang‐Ho Jung, Kyung Deuk Min, Choong-Jae Lee et al. · Applied Surface Science · 2019 · 35 citations

Materials Science, Chemical Engineering, Engineering +8

Fabrication of the hybrid Ag paste combined by Ag nanoparticle and micro Ag flake and its flexibility

Bum-Geun Park, Kwang‐Ho Jung, Seung‐Boo Jung · Journal of Alloys and Compounds · 2016 · 32 citations

Materials Science, Ag Nanoparticle, Engineering +7

Fabrication of Ag-MWNT nanocomposite paste for high-power LED package

Kwang‐Seok Kim, Bum-Geun Park, Hong-Sik Kim et al. · Current Applied Physics · 2015 · 17 citations

Materials Science, Solid-state Lighting, Engineering +5