Kyung Deuk Min

Mechanical properties of Sn-58 wt%Bi solder containing Ag-decorated MWCNT with thermal aging tests

Choong-Jae Lee, Kyung Deuk Min, Hyun Joon Park et al. · Journal of Alloys and Compounds · 2019 · 43 citations

Materials Science, Materials Engineering, Electrical Engineering +10

Intense pulsed light surface treatment for improving adhesive bonding of aluminum and carbon fiber reinforced plastic (CFRP)

Jae-Ha Kim, Choong-Jae Lee, Kyung Deuk Min et al. · Composite Structures · 2020 · 40 citations

Materials Science, Fibre-reinforced Plastic, Engineering +8

Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages

Kwang‐Ho Jung, Kyung Deuk Min, Choong-Jae Lee et al. · Applied Surface Science · 2019 · 35 citations

Materials Science, Chemical Engineering, Engineering +8

Mechanical properties and microstructural evolution of solder alloys fabricated using laser-assisted bonding

Hong-Sub Joo, Choong-Jae Lee, Kyung Deuk Min et al. · Journal of Materials Science Materials in Electronics · 2020 · 28 citations

Materials Science, Materials Engineering, Advanced Laser Processing +11

Pressureless die attach by transient liquid phase sintering of Cu nanoparticles and Sn-58Bi particles assisted by polyvinylpyrrolidone dispersant

Kwang‐Ho Jung, Kyung Deuk Min, Choong-Jae Lee et al. · Journal of Alloys and Compounds · 2018 · 25 citations

Materials Science, Colloidal Material, Sintering +9