IEEE Transactions on Electron Devices · 2008 · 17 citations · 12 references
EngineeringElectrical EngineeringElectronic MaterialsMicroelectronicsSemiconductor DevicesDevice CharacterizationIntegrated Circuit DesignMetal-oxide-semiconductor Field-effect TransistorsSemiconductor Device MaterialsStrain EngineeringDevice OptimizationLayout Optimization For Electrostatic Discharge
Electrostatic discharge performance of advanced FinFETs shows a delicate sensitivity to device layout and to processing parameters. Both N- and P-type MOS FinFET devices are characterized in bipolar operation mode as a function of layout parameters such as gate length and fin width. The impact of well implants, selective epitaxial growth, and strain is studied.
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Multi-gate devices for the 32nm technology node and beyond
Nadine Collaert, A. De Keersgieter, Abhisek Dixit et al. · 2007 · 60 citations
Engineering, Electrical Engineering, Electronic Materials +16