Dimitri Linten

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

Geert Van der Plas, Paresh Limaye, Igor Loi et al. · IEEE Journal of Solid-State Circuits · 2010 · 308 citations

Engineering, Computer Engineering, Electrical Engineering +17

Planar Bulk MOSFETs Versus FinFETs: An Analog/RF Perspective

V. Subramanian, Bertrand Parvais, Jonathan Borremans et al. · IEEE Transactions on Electron Devices · 2006 · 151 citations

Engineering, Electrical Engineering, Analog Electronics +16

A Physically Unclonable Function Using Soft Oxide Breakdown Featuring 0% Native BER and 51.8 fJ/bit in 40-nm CMOS

Kai-Hsin Chuang, E. Bury, R. Degraeve et al. · IEEE Journal of Solid-State Circuits · 2019 · 81 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +17

Design issues and considerations for low-cost 3D TSV IC technology

Geert Van der Plas, Paresh Limaye, A. Mercha et al. · 2010 · 61 citations

Engineering, Computer Engineering, Electrical Engineering +16

An Investigation on Border Traps in III–V MOSFETs With an In_0.53Ga_0.47As Channel

Zhigang Ji, Xiong Zhang, J. Franco et al. · IEEE Transactions on Electron Devices · 2015 · 51 citations · Full text

Engineering, Electrical Engineering, Materials Science +17