High aspect ratio copper through-silicon-vias for 3D integration

Damascene copper electroplating for chip interconnections

P. C. Andricacos, Cyprian Uzoh, John Dukovic et al. · IBM Journal of Research and Development · 1998 · 1.2K citations

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Three-dimensional integrated circuits

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Three-Dimensional Integrated Circuits and the Future of System-on-Chip Designs

Robert Patti · Proceedings of the IEEE · 2006 · 595 citations

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A wafer-scale 3-D circuit integration technology

J.A. Burns, Brian F. Aull, C.K. Chen et al. · IEEE Transactions on Electron Devices · 2006 · 269 citations

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Three-Dimensional Integration Technology Based on Wafer Bonding With Vertical Buried Interconnections

Mitsumasa Koyanagi, T. Nakamura, Yusuke Yamada et al. · IEEE Transactions on Electron Devices · 2006 · 221 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +17