Chongshen Song

High aspect ratio copper through-silicon-vias for 3D integration

Chongshen Song, Zheyao Wang, Qianwen Chen et al. · Microelectronic Engineering · 2008 · 63 citations

Engineering, Materials Engineering, Materials Science +11

A Scalable Network-on-Chip Microprocessor With 2.5D Integrated Memory and Accelerator

Sai Manoj Pudukotai Dinakarrao, Zhiyi Yu, Hao Yu et al. · IEEE Transactions on Circuits and Systems I Regular Papers · 2017 · 42 citations

Engineering, Computer Engineering, Computer Science +17

Bottom-up copper electroplating using transfer wafers for fabrication of high aspect-ratio through-silicon-vias

Chongshen Song, Zheyao Wang, Litian Liu · Microelectronic Engineering · 2009 · 32 citations

Engineering, Materials Engineering, Materials Science +14

Properties and electric characterizations of tetraethyl orthosilicate-based plasma enhanced chemical vapor deposition oxide film deposited at 400°C for through silicon via application

Meiying Su, Daquan Yu, Yijun Liu et al. · Thin Solid Films · 2013 · 17 citations

Natural Sciences, Materials Engineering, Materials Science +16

Moving Boundary Simulation and Experimental Verification of High Aspect-Ratio Through-Silicon-Vias for 3-D Integration

Chongshen Song, Zheyao Wang, Zhimin Tan et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 13 citations

Engineering, Electrical Engineering, Materials Science +17