A Scalable Network-on-Chip Microprocessor With 2.5D Integrated Memory and Accelerator

Abstract

This paper presents a 2.5D integrated microprocessor die, memory die, and accelerator die with 2.5D silicon interposer I/Os. The use of such 2.5D silicon interposer I/Os provide a scalable interconnection for core-core (up to 32 cores), core-memory (4× storage capacity) and core-accelerator (4.4× speedup in H.264 decoder). The 2.5D integrated chip was implemented in GF 65 nm process with multicore microprocessor operated at 500 MHz under 1.2 V supply with 1.08 W power dissipation. A pair of 8 Gbps 2.5D silicon interposer I/O is designed for each of 12 inter-die communication channels, achieving a bandwidth of 24 GBps with 7.5 pJ/bit energy efficiency. As a result, the specified applications such as H.264 video data analytics and AES encryption can achieve significant performance improvement of throughput and energy efficiency.