Concepedia
Statistics
Publications
24
Citations
901
H-Index
17
Active since
1996
Affiliations
Chinese Academy of Sciences(Current)
Institute of Microelectronics
National Center for Advanced Packaging (China)
Peking University
Dalian University of Technology
Meiying Su is an author at Chinese Academy of Sciences specializing in engineering, materials science, and electronic packaging.
Top concepts
EngineeringMaterial ScienceElectronic PackagingApplied PhysicsElectrical EngineeringMicroelectronicsMicrostructureAdvanced PackagingMaterials EngineeringSensors
Publications per year
1996–2024
Formaldehyde gas sensor based on SnO2/In2O3 hetero-nanofibers by a modified double jets electrospinning process
Haiying Du, Jing Wang, Meiying Su et al. · Sensors and Actuators B Chemical · 2012 · 174 citations
Nanofiber, Chemical Engineering, Engineering +10
Review of Packaging Schemes for Power Module
Fengze Hou, Wenbo Wang, Liqiang Cao et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2019 · 138 citations · Full text
Advanced Packaging, Electrical Engineering, Sic Devices +12
Sensitivity and complex impedance of nanometer zirconia thick film humidity sensors
Jing Wang, Meiying Su, Jin-Qing Qi et al. · Sensors and Actuators B Chemical · 2009 · 95 citations
Materials Science, Electrical Engineering, Engineering +10
Fan-Out Panel-Level PCB-Embedded SiC Power MOSFETs Packaging
Fengze Hou, Wenbo Wang, Rui Ma et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2019 · 42 citations
Sic Mosfet, Electrical Engineering, Engineering +10
Warpage simulation and experimental verification for 320 mm × 320 mm panel level fan-out packaging based on die-first process
Meiying Su, Liqiang Cao, Tingyu Lin et al. · Microelectronics Reliability · 2018 · 37 citations
Advanced Packaging, Electrical Engineering, Experimental Verification +10
1–5 of 24