Concepedia

Fengze Hou

FH

Statistics

Publications

29

Citations

864

H-Index

18

Active since

2010

Affiliations

Chinese Academy of Sciences(Current)

Institute of Microelectronics

National Center for Advanced Packaging (China)

Delft University of Technology

University of Chinese Academy of Sciences

Fengze Hou is an author at Chinese Academy of Sciences specializing in engineering, thermal design, and heat transfer.

Publications per year

2010–2025

29

Publications

29

Review of Packaging Schemes for Power Module

Fengze Hou, Wenbo Wang, Liqiang Cao et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2019 · 146 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package

Fengze Hou, Tingyu Lin, Liqiang Cao et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2017 · 75 citations

Engineering, Materials Engineering, Materials Science +15

Thermal Modeling of a Chiplet-Based Packaging With a 2.5-D Through-Silicon Via Interposer

Minghao Zhou, Li Li, Fengze Hou et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 46 citations

Engineering, Materials Engineering, Materials Science +17

Fan-Out Panel-Level PCB-Embedded SiC Power MOSFETs Packaging

Fengze Hou, Wenbo Wang, Rui Ma et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2019 · 43 citations · Full text

Engineering, Electrical Engineering, Electronic Materials +16

Nonlinear elastic deformation behaviour of Ti–30Nb–12Zr alloys

Fengze Hou, S.J. Li, Yulin Hao et al. · Scripta Materialia · 2010 · 41 citations

Natural Sciences, Materials Engineering, Materials Science +14

1–5 of 29