Fengze Hou

Review of Packaging Schemes for Power Module

Fengze Hou, Wenbo Wang, Liqiang Cao et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2019 · 138 citations · Full text

Advanced Packaging, Electrical Engineering, Sic Devices +12

Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package

Fengze Hou, Tingyu Lin, Liqiang Cao et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2017 · 73 citations

Fan-Out Panel-Level PCB-Embedded SiC Power MOSFETs Packaging

Fengze Hou, Wenbo Wang, Rui Ma et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2019 · 42 citations

Sic Mosfet, Electrical Engineering, Engineering +10

Thermal Modeling of a Chiplet-Based Packaging With a 2.5-D Through-Silicon Via Interposer

Minghao Zhou, Li Li, Fengze Hou et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 41 citations

Engineering, Mechanical Engineering, Refrigeration +21

Nonlinear elastic deformation behaviour of Ti–30Nb–12Zr alloys

Fengze Hou, S.J. Li, Yulin Hao et al. · Scripta Materialia · 2010 · 39 citations

Materials Science, Engineering, Ti–30nb–12zr Alloys +4